The silicon chip, a marvel of human ingenuity, has become the backbone of modern technology. But beyond the familiar CPU and GPU, a new frontier is emerging – advanced packaging technology. It’s a world of intricate layers and microscopic connections, pushing the limits of computing power and enabling us to tackle increasingly complex tasks.
Recently, ASE, a leading semiconductor packaging company, unveiled a stunning model in Taiwan, offering a glimpse into the intricate world of advanced packaging. This model showcased the components that come together to form a powerful AI chip, using a technique called CoWoS (Chip On Wafer On Silicon).
At the heart of this complex system lies the XPU or GPU logic die, the brain of the operation, performing all the calculations. Surrounding this central chip are multiple layers of high-bandwidth memory (HBM), produced by industry giants like SK hynix, Samsung, and Micron. This HBM serves as the chip’s ultra-fast memory, providing the lightning-speed data access needed for demanding AI workloads.
This entire assembly is carefully packaged together using microbumps, seamlessly connecting the components to the copper-colored RDL (redistribution layer). Beneath the silver-colored component lies the silicon interposer, acting as a crucial intermediary between the chip and the substrate.
This intricate interplay of components showcases the sophisticated nature of advanced packaging. It’s not just about packing more transistors onto a chip; it’s about optimizing communication between different components to achieve maximum efficiency. The future holds even more promise. Companies like TSMC and Samsung are pushing the boundaries further with panel-level packaging, a revolutionary approach that promises even faster speeds and higher densities.
The impact of advanced packaging extends far beyond the realm of AI chips. It plays a critical role in enhancing the performance of consumer electronics, gaming consoles, and even supercomputers.
Think of it this way: Just as a high-performance gaming PC relies on fast GDDR6, GDDR6X, and the upcoming GDDR7X memory to deliver smooth gameplay, AI chips rely on HBM for their computational prowess. The faster and wider the memory bus, the better the chip can handle complex AI calculations.
HBM3 is currently the gold standard for AI GPUs, powering NVIDIA’s latest Hopper H200 AI GPU and its upcoming Blackwell AI GPUs. HBM4 and HBM4E are expected to debut in 2025 and 2026, respectively, with NVIDIA’s next-generation Rubin R100 AI GPU leading the charge.
As AI workloads become increasingly demanding, the race to achieve higher memory bandwidth intensifies. This is where the power of advanced packaging technology truly shines. It unlocks the potential for even faster and more efficient AI systems, pushing the limits of what’s possible in the world of computing.
The miniature world of advanced packaging is a testament to human innovation, enabling us to create increasingly powerful and sophisticated computing systems. It’s a fascinating realm where microbumps and interposers create the foundations for groundbreaking AI, gaming, and scientific discoveries. As we move forward, advanced packaging promises to revolutionize computing, shaping the future of technology and driving the next wave of innovation.
