TSMC has finalized its first wave of purchases for ASML’s cutting-edge High-NA EUV lithography machines. These machines will be crucial for TSMC’s next-generation A14 process, slated for mass production in Q3 2027, and the subsequent A14P process node, expected in 2028. According to DigiTimes, TSMC’s large-scale procurement plan makes it ASML’s largest customer, further solidifying its dominance in the chip manufacturing industry. TSMC’s role is particularly crucial for ASML’s future growth, especially with the Chinese market’s development facing ongoing suppression.
Intel, TSMC’s chief rival, had already installed ASML’s first High-NA EUV machines at its R&D base in Hillsboro, Oregon. ASML’s advanced TwinScan EXE:5000 lithography machine, valued at $380 million USD, is a testament to the technological prowess required for producing cutting-edge chips.
The news of TSMC’s purchase follows a meeting between TSMC CEO C.C. Wei and ASML executives in the Netherlands just a few months ago, where securing these advanced machines was a key topic of discussion. ASML plans to deliver the High-NA EUV machines to TSMC in 2027 after completing essential calibration steps.
DigiTimes reports that TSMC holds a commanding market presence and has placed the largest orders for ASML’s new High-NA EUV machines. With its current 3nm production lines fully booked until 2026, and its 2nm process node expected to enter mass production in Q4 2025, TSMC continues to attract orders for next-generation chips. The momentum for EUV machine purchases has been reignited, with an estimated 70 units on order. At $380 million per machine, this translates to a massive $26.6 billion in new orders for ASML from TSMC alone.
TSMC has reportedly negotiated significant discounts for next-generation EUV equipment with ASML and has established a five-year roadmap for process technology and promotion. The company’s A14 process node is expected to enter risk trial production in the first half of 2026, with mass production targeted for Q3 2027.
