Samsung Electronics is gearing up to enhance its semiconductor manufacturing capabilities with the installation of a cutting-edge High-NA EUV lithography machine. This move is a strategic response to the ongoing competition in the global semiconductor market, particularly against major players like TSMC.
According to a report by SEDaily, Samsung’s Semiconductor (DS) Division will receive one of ASML’s TwinScan EXE:5000 High-NA EUV (Extreme Ultra Violet) lithography machines. These machines are considered the pinnacle of lithography technology, enabling the production of smaller and more complex semiconductor circuits.
Intel was the first recipient of ASML’s High-NA EUV machines in the United States, followed by TSMC in Taiwan. Now, Samsung joins the ranks, further solidifying its commitment to advanced chip manufacturing. While Intel made a substantial investment to secure the first machines, Samsung is reportedly acquiring the eighth machine in the series. Notably, SK hynix, another South Korean semiconductor giant, plans to acquire an EXE:5200 High-NA EUV machine for DRAM production in the near future.
Samsung’s new High-NA EUV machine is anticipated to be operational in the first half of 2025. This investment signifies Samsung’s determination to remain at the forefront of the semiconductor industry, competing with established leaders like TSMC and Intel in the development of next-generation chips.
