Get ready for a new era of PC building with ASUS’s upcoming Z890 BTF motherboards! While no specific Z890 BTF model is set for an immediate release, ASUS has confirmed that they are actively developing and refining the technology behind this unique design. During a recent livestream, ASUS North America revealed their commitment to BTF (Backside Thermal Flow) technology, which features a sleek design and the innovative backside power connectors.
This exciting news hints at a possible reveal of the Z890 BTF motherboards at the highly anticipated CES 2025 event in early January 2025. These boards are expected to join the ROG, TUF Gaming, and other ASUS motherboard families, providing high-performance options for gamers and enthusiasts.
The Z890 BTF motherboards are not the only exciting development from ASUS. The company is also gearing up to launch its powerful new Core Ultra processor series, including the Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5 245K. These processors are expected to deliver significant performance improvements for PC builders, offering a boost to both gaming and other demanding tasks.
The combination of the Z890 BTF motherboards and the Core Ultra series processors signifies a significant shift in ASUS’s focus on innovative PC hardware. Keep an eye out for more news and details as we approach CES 2025, where ASUS is poised to unveil its latest technological advancements.
