The tech world is buzzing with anticipation as AMD’s highly anticipated flagship Strix Halo APU makes an early appearance on Geekbench. Leaked benchmarks reveal the impressive specifications of the Ryzen AI Max+ 395 processor, set to debut at CES 2025. This isn’t just any processor; it’s a powerhouse promising exceptional performance in a compact form factor.
The Geekbench listing confirms the full name: “AMD RYZEN AI MAX+ 395 w/ Radeon 8060S.” This confirms the adoption of the “Max+” naming convention, a departure from the “9” seen in previous Strix Point APUs. The Ryzen AI Max+ 395 boasts a formidable 16 cores and 32 threads leveraging the power of Zen 5 architecture. But the real head-turner is the integrated graphics – a Radeon 8060S with a whopping 40 RDNA 3.5-based Compute Units (CUs). This represents a substantial increase in integrated GPU power compared to previous generations.
Further enhancing its capabilities, the Ryzen AI Max+ 395 will feature a substantial 32MB of L3 cache per CCD, resulting in a total of 64MB of MALL cache. This large cache will significantly improve performance and responsiveness. The APU also supports up to a staggering 96GB of RAM, ensuring seamless multitasking and handling of demanding applications.
However, early benchmarks reveal a curious detail. The Radeon 8060S achieved a score of 67,004 points in the Vulkan test of Geekbench. While this is still a respectable score, it falls short of the 90,577 points achieved by the discrete Radeon RX 7600 (32 CUs). This difference is likely attributable to the inherent limitations of integrated graphics within the form factor constraints of laptops and handheld devices, as well as TDP considerations. Despite this, previous leaks suggest the Strix Halo APU will deliver performance competitive with NVIDIA’s GeForce RTX 4070 Laptop GPU, making it a truly compelling offering.
The implication of this performance is significant. AMD is aiming for a powerful, integrated solution capable of handling demanding workloads in a mobile form factor. This could be a game-changer for thin-and-light laptops, gaming handhelds, and other power-efficient devices that previously had to sacrifice graphical power for portability. The full extent of the Ryzen AI Max+ 395’s capabilities will be unveiled at CES 2025, which is just around the corner; the excitement is palpable. Stay tuned for the official reveal!
