E&R Engineering Corp. (8027.TWO) has taken a significant step towards revolutionizing the semiconductor industry with the launch of its ‘E-Core System’ and the formation of the ‘Glass Substrate Supplier E-Core System Alliance.’ The alliance, which combines the expertise of key industry players like Manz AG, Scientech, ShyaWei Optronics, and others, aims to provide comprehensive solutions for next-generation advanced packaging using glass substrates.
The growing demand for AI chips, high-frequency, and high-speed communication devices has led to a surge in the need for advanced packaging technologies. Glass substrates offer a compelling advantage over traditional copper foil substrates due to their higher wiring density, better signal performance, high flatness, and ability to withstand high temperatures and voltages.
The critical aspect of glass substrate technology is the first step—glass laser modification (TGV), which creates through-glass vias for electrical connections. While TGV has been around for over a decade, the speed of the process has been a major hurdle for mass production. E&R Engineering has successfully overcome this challenge, developing a breakthrough in TGV technology that enables the production of up to 8,000 vias per second for fixed patterns (matrix layout) or 600 to 1,000 vias per second for customized patterns (random layout). This achievement, with an accuracy of +/- 5 μm, meeting the 3 sigma standard, finally brings glass substrates to the realm of mass production.
E&R Engineering’s E-Core System encompasses the entire glass substrate process, including glass metallization, ABF (Ajinomoto Build-up Film) lamination, and final substrate cutting. Key steps in glass metallization include TGV, wet etching, AOI (Automated Optical Inspection), sputtering, and plating.
This innovative technology will be showcased at SEMICON Taiwan 2024 (Taipei Nangang Exhibition Center Hall 1, Booth #N0968, September 4-6) and SEMICON Europa 2024 (Messe München, Booth #C2622, November 12-15). With its E-Core System Alliance, E&R Engineering is poised to play a pivotal role in shaping the future of advanced packaging, pushing the boundaries of semiconductor technology and ushering in a new era of high-performance electronics.
