Micron has made a significant advancement in memory technology with the launch of its production-ready HBM3E 12-Hi memory. This innovative memory solution offers a remarkable 36GB capacity, a 50% increase over the existing HBM3E 8-Hi stacks. This substantial boost in capacity empowers AI processors to handle larger and more complex AI models, like the 70 billion parameter Llama 2, without the need for CPU offload or GPU-GPU communication delays. The result is a significant acceleration in time to insights for various AI applications.
Beyond its impressive capacity, Micron’s HBM3E 12-Hi memory delivers exceptional performance. It achieves a staggering memory bandwidth of over 1.2TB/s at a pin speed exceeding 9.2Gbps. This high-speed performance is crucial for handling the demanding data requirements of AI workloads. Notably, Micron’s HBM3E 12-Hi memory consumes significantly less power compared to its competitors’ HBM3E 8-Hi 24GB memory, making it an energy-efficient choice for data centers.
Furthermore, Micron’s HBM3E 12-Hi memory incorporates fully programmable MBIST (Memory Built-In Self-Test) capabilities. This feature allows the memory to run system-representative traffic at full-spec speed, providing extensive test coverage and accelerating validation processes. Consequently, this translates to faster time-to-market (TTM) and enhanced system reliability.
In essence, Micron’s HBM3E 12-Hi 36GB memory stands out with its high capacity, exceptional bandwidth, energy efficiency, and advanced testing capabilities. These attributes make it an ideal solution for meeting the demands of today’s powerful AI GPUs and driving innovation in the field of artificial intelligence.
