Samsung has announced a strategic partnership with AMD, a global leader in high-performance computing and AI semiconductor solutions. Samsung Electro-Mechanics (SEMCO), a subsidiary of the South Korean tech giant, will provide high-performance substrates for AMD’s next-generation CPUs and GPUs designed for hyperscale data center applications. This collaboration signifies a significant step in meeting the ever-increasing demand for advanced computing power in data centers worldwide.
The semiconductor substrate market is projected to grow at an average annual rate of 7%, reaching 20 trillion KRW by 2028, according to market research firm Prismark. SEMCO’s commitment to this growing market is evident in its 1.9 trillion KRW investment in a new FCBGA factory. This investment underscores the company’s dedication to pushing the boundaries of substrate technology and manufacturing capabilities to meet the highest industry standards and future technological demands.
This partnership focuses on addressing the unique challenges of integrating multiple semiconductor chips (chiplets) onto a single large substrate. These high-performance substrates are essential for CPUs and GPUs, offering significantly larger surface areas and higher layer counts. They provide the dense interconnections required for today’s advanced data centers.
Data center substrates are significantly larger and more complex than standard computer substrates, featuring 10 times the size and 3 times the layers. This complexity necessitates efficient power delivery and lossless signal integrity between chips, which SEMCO’s innovative manufacturing processes ensure. The company’s advanced manufacturing techniques mitigate problems like warpage, guaranteeing high yields during chip mounting.
SEMCO’s FCBGA factory incorporates advanced real-time data collection and modeling capabilities, enabling the development of predictive manufacturing models. These models ensure the signal, power, and mechanical integrity of the substrates. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components, meeting the forward-looking needs of next-generation data centers.
Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics, expressed his enthusiasm for the partnership, stating, “We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions. Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems.”
Scott Aylor, Corporate VP of Global Operation Manufacturing Strategy at AMD, emphasized the company’s commitment to innovation and the importance of collaborations like this, saying, “At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers. Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products.”
