E&R Engineering Corp. has formed the ‘Glass Substrate Supplier E-Core System Alliance’ to promote comprehensive solutions for next-generation advanced packaging using glass substrates. This alliance, fueled by the company’s breakthrough in glass laser modification technology, enables the mass production of glass substrates, which offer significant advantages over traditional substrates for AI chips, high-frequency, and high-speed communication devices.
Kaynes SemiCon, a subsidiary of Kaynes Technology, has secured a landmark deal with Lightspeed Photonics, becoming the first company in India to provide outsourced semiconductor assembly and test (OSAT) services. This agreement marks a significant step forward for India’s nascent semiconductor ecosystem and positions Kaynes SemiCon as a key player in the global supply chain for advanced packaging solutions.
Onto Innovation (ONTO) stock is thriving, fueled by increasing demand for its Dragonfly inspection systems used in advanced packaging for AI chips. The company’s strong financial performance, driven by its AI packaging customers and new product launches, is propelling its growth. Despite headwinds, ONTO’s future looks promising with continued investments in AI technologies.
