TSMC, the world’s leading semiconductor manufacturer, will receive its first High-NA EUV lithography machine from ASML later this month, marking a significant advancement in its manufacturing capabilities and fueling the ongoing race for chip dominance with rivals like Samsung and Intel.
India is set to introduce a fresh package of incentives aimed at boosting domestic semiconductor production. This move comes alongside a new partnership with the United States, further bolstering India’s position in the global chip manufacturing landscape.
Taiwan Semiconductor Manufacturing Company (TSMC) is planning to build its third chip manufacturing facility in Japan by 2030, following the successful launch of its first two plants in the country. The move comes as part of Japan’s strategy to strengthen its semiconductor supply chains and solidify its position in the industry.
Intel is considering a major restructuring, potentially separating its chip design and manufacturing businesses. This move comes as the company faces its most challenging period in its history, marked by declining performance and financial losses. CEO Pat Gelsinger is exploring options to revitalize Intel, with the potential sale of the foundry business a key consideration.
Intel is reportedly expanding its outsourcing of chip production to TSMC, including its new 3nm process node. The company is also outsourcing backend design and advanced packaging to Taiwanese companies like Egis, Shichixin, and KYEC, indicating a greater reliance on TSMC’s expertise as Intel struggles with its own advanced processes.
TSMC has finalized its first wave of purchases for ASML’s advanced High-NA EUV lithography machines, solidifying its position as ASML’s largest customer and driving the company’s future growth. This move signifies TSMC’s commitment to its next-generation A14 process node, expected to enter mass production in Q3 2027, and its dominance in the chip manufacturing industry.
TSMC’s recent announcements have raised questions about Intel’s claims of chip superiority. TSMC’s new A16 chip fabrication process and backside power supply technology surpass expectations, driven by demand from AI chip companies. Intel’s similar technology, 14A, may face competition as analysts debate its effectiveness. However, both TSMC and Intel’s technologies are still in development and must deliver on their promises.
TSMC’s plan to construct semiconductor manufacturing plants overseas will result in higher chip production costs, which will be passed on to customers. The Taiwanese foundry’s CEO, C.C. Wei, confirmed that microchips produced outside of Taiwan will face elevated manufacturing expenses due to factors like inflation and energy costs. Despite global expansion, TSMC aims to maintain a 53% gross margin by adjusting pricing strategies to cover increased expenses. The company seeks government support and leverages its technological advantage to mitigate costs.
