Taiwan Semiconductor Manufacturing Company (TSMC) is set to acquire new high-precision extreme ultraviolet (EUV) lithography machines from ASML Holding NV, boosting its chipmaking capabilities. This acquisition comes amidst geopolitical tensions and potential price negotiations between the two companies.
SK hynix is developing 4F2 (square) DRAM, a 3D structure similar to Samsung’s VCT, to combat soaring EUV process costs. This vertical stacking technology promises to reduce die surface area by 30% and potentially halve EUV costs, paving the way for more efficient and cost-effective DRAM production.
