Broadcom unveils its groundbreaking 3.5D eXtreme Dimension System in Package (XDSiP) platform, pushing the boundaries of AI computing with unprecedented integration density and efficiency. This innovative technology addresses the limitations of Moore’s Law, paving the way for next-generation AI accelerators.
Results for: High-Performance Computing
Taiwan Semiconductor Manufacturing Co (TSM) is significantly accelerating its 2-nanometer chip production, six months ahead of schedule, fueling advancements in AI and high-performance computing. This expansion, including new fabs in Kaohsiung, positions Taiwan as a global semiconductor leader and promises to boost the regional economy.
Dell unveils its groundbreaking IR7000 server racks, boasting an unprecedented 480kW per rack power capacity with direct liquid cooling. Designed for AI, cloud, and HPC workloads, this innovative system promises unparalleled scalability, sustainability, and efficiency in high-density computing environments.
Applied Digital Corporation, a leader in next-generation digital infrastructure for high-performance computing, has successfully completed a $450 million offering of convertible senior notes. The company plans to utilize the proceeds for share repurchases, capped call transactions, and general corporate purposes, demonstrating its commitment to strategic growth and shareholder value.
Core Scientific Inc (CORZ) saw its shares rise after announcing that CoreWeave, an AI hyperscaler, exercised its final option for a 200 megawatt (MW) hosting contract. This move will see Core Scientific expand its infrastructure to deliver an additional 120 MW of IT load, hosting CoreWeave’s Nvidia GPUs. The expansion is expected to significantly boost Core Scientific’s revenue and position it as a leading data center player in the rapidly growing high-performance computing (HPC) market.
Needham analyst John Todaro initiated coverage on TeraWulf Inc (WULF) with a Buy rating and a $6 price target, citing the company’s potential in the high-margin High-Performance Computing (HPC) market. Todaro believes TeraWulf is well-positioned to capitalize on this growing market with its existing data center infrastructure and plans to bring a 100MW+ site online for HPC. He expects TeraWulf to generate significant revenue from HPC in the coming years, leading to attractive margins.
SK hynix has introduced its latest GDDR7 memory, boasting 32Gbps speeds for graphics cards and AI applications. The new memory offers a significant leap in performance and efficiency compared to its predecessor, promising to revolutionize the high-end computing landscape.
Nodal Power, Inc., a pioneer in sustainable energy solutions for data centers, has secured a groundbreaking patent from the United States Patent and Trademark Office (Patent No. 11972498). The patent, aptly titled “Optimized Local Power Systems,” recognizes and protects Nodal Power’s innovative approach to utilizing sustainable energy sources for powering data centers. This patent marks a significant milestone in Nodal Power’s mission to revolutionize data center operations while promoting environmental sustainability.
LightSolver presents the LPU100 optical computer, a desktop-sized device that employs advanced laser interference techniques to perform complex calculations at lightning-fast speeds. This innovative technology offers a low-energy, room-temperature solution for tackling demanding computational problems, making it a practical alternative to resource-intensive quantum computers and supercomputers. The LPU100’s capabilities include vector-matrix multiplication in just 10 nanoseconds, outperforming traditional GPUs by hundreds of times. With its ease of use and affordability, the LPU100 opens up a world of possibilities for advanced computing in finance, aerospace, logistics, manufacturing, and beyond.
The global immersion cooling market is estimated to grow substantially between 2023 and 2027, driven by the increasing demand for energy-efficient and sustainable cooling solutions for data centers and other high-performance computing applications. The market is expected to witness significant growth due to the increasing adoption of immersion cooling solutions by major companies like Aecorsis BV, Bitfury Group Ltd., and DCX The Liquid Cooling Co. These companies offer diverse cooling solutions to meet the unique needs of various industries.