TSMC’s Japanese Fab to Begin Mass Production in 2024, Boosting Japan’s Semiconductor Industry

TSMC is establishing its first Japanese wafer fabrication plant in Kumamoto, set to begin mass production before the end of 2024. This significant investment will supply chips to Sony and Denso, initially focusing on 22nm and 28nm nodes, with plans to expand to 6nm and 7nm in the future. The project, supported by the Japanese government, aims to revitalize Japan’s semiconductor industry and strengthen its supply chain. This development reflects the global demand for semiconductors driven by the electric vehicle and AI industries.

Qualcomm’s Potential Intel Acquisition Falters Amidst Complexities and Challenges

Qualcomm’s interest in acquiring Intel appears to be cooling due to the complexities of such a large-scale merger. While a full acquisition may be off the table for now, Qualcomm hasn’t ruled out purchasing parts of Intel or revisiting the idea later. This development comes as Intel faces financial headwinds, including reduced CHIPS Act funding and slower-than-expected AI chip sales.

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