Taiwan Semiconductor Manufacturing Company (TSMC), a leading semiconductor manufacturer, is poised to establish its third chip plant in Japan as early as 2030. This expansion follows the company’s recent success in building its first two chip-making facilities in the country, known as the “Nightless Castle” project, which involved 24-hour operations to complete construction in under two years.
Taiwan’s Minister of Economic Affairs, Kuo Jyh-huei, confirmed the plans for a new facility that will manufacture advanced chips. While he did not specify the exact location, he indicated it would be in Japan, likely near TSMC’s existing fabs in Kumamoto Prefecture.
The minister explained the rationale behind the 2030 timeline, highlighting the need for experienced engineers to produce advanced chips. “Japan lacks enough experience so (such skilled engineers) will not be available until 2030 or later,” he stated during an interview with Kyodo News.
Recognizing the crucial role of skilled personnel, the minister expressed willingness to collaborate with Japan on training programs for engineers. This partnership underscores Japan’s strategic focus on fortifying its semiconductor supply chains, a critical aspect of its future in the industry.
TSMC’s commitment to Japan aligns with the country’s ambition to regain prominence in the global semiconductor landscape. The company’s CEO, C.C. Wei, had previously indicated in June 2024 that TSMC would explore building a third factory in Japan.
Adding further momentum to the project, Kumamoto Governor Takashi Kimura recently visited TSMC’s headquarters in Taiwan, urging the company to consider establishing a third plant in the prefecture.
TSMC’s expansion plans are well-timed, with mass production at its first Japanese factory expected by the end of 2024 and the second plant commencing operations in 2027. If the third plant comes to fruition as anticipated, it will mark a significant milestone in TSMC’s global presence and Japan’s semiconductor industry resurgence.
