TSMC, the world’s leading semiconductor foundry, is witnessing a surge in demand for its cutting-edge 3nm process node. This advanced technology is attracting a diverse array of customers, from tech giants like Apple and Intel to AI chip specialists like AMD and NVIDIA, further solidifying TSMC’s position as a critical player in the global semiconductor landscape.
The latest additions to TSMC’s 3nm customer list are AI chips, further highlighting the growing importance of artificial intelligence in various industries. AMD’s upcoming Instinct MI350 series AI accelerator and NVIDIA’s next-generation Rubin R100 AI GPU are slated for production on TSMC’s 3nm node in the second half of 2025. This move places AMD and NVIDIA alongside other prominent customers like Apple, Intel, MediaTek, and Qualcomm, who are already leveraging TSMC’s advanced manufacturing capabilities.
This growing demand for TSMC’s 3nm node is creating a ripple effect throughout the semiconductor industry. The production capacity at TSMC is being pushed to its limits as companies clamor for access to this advanced technology. Ctee, a reputable Taiwanese news source, reports that NVIDIA’s orders for TSMC’s 3nm and 5nm nodes are expected to exceed those of 2024, further straining TSMC’s manufacturing capabilities.
The entry of AI chips into the 3nm race is also driving significant changes in the advanced packaging space. CoWoS (Chip-on-Wafer-on-Substrate), a specialized packaging technology, is crucial for these AI chips, particularly for NVIDIA’s Blackwell B200, AMD’s Instinct MI300, and Intel’s Gaudi 3. The demand for CoWoS packaging is expected to grow, creating additional pressure on TSMC’s production resources.
This surge in demand for TSMC’s 3nm node is not a temporary phenomenon. It reflects a fundamental shift in the semiconductor industry, where AI is rapidly becoming a driving force. As AI applications continue to evolve and demand for more powerful computing increases, TSMC’s 3nm node will remain at the forefront of technological innovation. The company’s ability to meet this growing demand will be critical in determining the future of the semiconductor industry and the development of AI technologies.
The list of chips being fabbed on TSMC’s new 3nm process node includes:
*
Apple:
M4, A18, A18 (iPhone)*
MediaTek:
Dimensity C-X1 (auto chip)*
Qualcomm:
Snapdragon 8 Gen4*
Intel:
Lunar Lake, Arrow Lake*
AMD:
Zen 5 CPUs, Instinct MI350 series AI accelerators*
NVIDIA:
Rubin R100 AI GPU*
NVIDIA + MediaTek:
Arm-based AI PC processor (to be revealed in Q2 2025, mass produced in Q3 2025)The future of the semiconductor industry is inextricably linked to the success of TSMC’s 3nm node. As the race to develop AI chips heats up, TSMC’s capacity to meet the growing demand will be a major factor in determining the pace of innovation in the years to come.
